JPS6234467Y2 - - Google Patents

Info

Publication number
JPS6234467Y2
JPS6234467Y2 JP1981088271U JP8827181U JPS6234467Y2 JP S6234467 Y2 JPS6234467 Y2 JP S6234467Y2 JP 1981088271 U JP1981088271 U JP 1981088271U JP 8827181 U JP8827181 U JP 8827181U JP S6234467 Y2 JPS6234467 Y2 JP S6234467Y2
Authority
JP
Japan
Prior art keywords
light emitting
layer
type layer
emitting element
multicolor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981088271U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57200048U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981088271U priority Critical patent/JPS6234467Y2/ja
Publication of JPS57200048U publication Critical patent/JPS57200048U/ja
Application granted granted Critical
Publication of JPS6234467Y2 publication Critical patent/JPS6234467Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1981088271U 1981-06-15 1981-06-15 Expired JPS6234467Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981088271U JPS6234467Y2 (en]) 1981-06-15 1981-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981088271U JPS6234467Y2 (en]) 1981-06-15 1981-06-15

Publications (2)

Publication Number Publication Date
JPS57200048U JPS57200048U (en]) 1982-12-20
JPS6234467Y2 true JPS6234467Y2 (en]) 1987-09-02

Family

ID=29883451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981088271U Expired JPS6234467Y2 (en]) 1981-06-15 1981-06-15

Country Status (1)

Country Link
JP (1) JPS6234467Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953668U (en]) * 1972-08-21 1974-05-11
JPS4985064U (en]) * 1972-11-10 1974-07-23
JPS52148055U (en]) * 1976-05-07 1977-11-09

Also Published As

Publication number Publication date
JPS57200048U (en]) 1982-12-20

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